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Title:Study on microhardness and microstructure for Cu-9Ni-6Sn alloy
Authors: Wu Zheng1 2  Gong Liukui1 2 3  Zhao Xiaoxiao1 2  Liu Xiaobin1 2  Song Shixin1 2  Deng Lixun1 2  Huang Wei1 2 
Unit: (1.Ningbo Branch of Chinese Academy of Ordnance Science  Ningbo 315103  China   2.Inner Mongolia Metal Material Research Institute  Baotou 014034  China   3.China North Material Science and Engineering Technology Group Co. Ltd.  Ningbo 315103  China) 
KeyWords: Cu-9Ni-6Sn alloy  microhardness  extrusion  solution treatment  grain boundary migration grain merging 
ClassificationCode:TG146.1
year,vol(issue):pagenumber:2025,50(4):97-106
Abstract:

 The microstructure and properties of Cu-9Ni-6Sn alloy were studied by using the detection methods such as OM, SEM, EBSD, TEM and hardness tester. The results show that after extrusion treatment, the grain size of Cu-9Ni-6Sn alloy is greatly reduced, and it is basically equiaxed and evenly distributed. The coarse Sn-rich phase at the as-cast grain boundary is broken and the number is reduced. The interior mainly contains micro-sized Sn-rich phase, nano-sized long strip and granular NixSny compounds. The optimal solid solution process of Cu-9Ni-6Sn alloy is 950 ℃/2 h+water quenching. During this process, the grains grow to 394.565 μm, accompanying grain boundary migration and grain merging. However, the micro-sized Sn-rich phase and nano-sized NixSny compounds at the grain boundary are basically dissolved back into the matrix, and only a small amount of granular Sn-rich phase remains. The overall solid solution effect is good.

 
Funds:
基金项目:创建国家自主创新示范区项目(XM2024XTGXQ12);宁波市重点研发计划(2023Z092,2023Z096)
AuthorIntro:
作者简介:武峥(1998-),男,硕士研究生
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