In order to investigate the effects of stamping structure for liquid-cooling plate on the heat dissipation performance of battery module, the stamping structure parameters of liquid-cooling plate were analyzed and designed, and CFD (Computational Fluid Dynamics) fluid-solid thermal coupled numerical calculation method was used to analyze the heat dissipation performance, energy consumption, and uniform temperature performance under various flow channel structure parameters of liquid-cooling plate. The results show that when the width of central flow channel decreases, the heat dissipation and temperature uniformity performances of the liquid-cooling system are significantly improved. When the width of central flow channel W5 is equal to 7 mm, the average temperature drops by 2.5% and the maximum temperature difference decreases by 7.7%. The smaller the depth of flow channel is, the better the heat dissipation and temperature uniformity performances of liquid-cooling system are, and the energy consumption increases significantly. When the depth of flow channel is 2 mm, the average temperature decreases by 26.9%, the maximum temperature difference decreases by 32.7%, and the flow resistance increases by 3.4 times. The average temperature drops by 3.8% in liquid-cooling system adding the enhanced heat transfer structure, and the maximum temperature difference decreases by 15.1%. Compared with adding an enhanced heat transfer structure in the whole area, adding enhanced heat transfer structure in some area can reduce the flow resistance and energy consumption without causing significant changes in the heat dissipation and temperature uniformity performances of the system.