Transactions of Materials and Heat Treatment

Title：Tensile test and surface layer effect of ultra fine grain thin copper sheet prepared by electrodeposition

Authors： TONG Min-jie WANG Chang-wen LEI Kun ZHANG Kai-feng(School of Materials Science and Engineering Harbin Institute of Technology Harbin Helongjiang 150001 China)

Unit：

KeyWords： electrodeposition ultra fine grained copper surface layer effect scale effect.

ClassificationCode：TG386

year,vol(issue):pagenumber：2007,32(1):16-19

Abstract：

Fine grained thin copper sheet was prepared by electrodeposition method.The grains size is uniform and the density is high.The changes during tensile test at room temperature of materials strength and plasticity are investigated for deferent grain size and thickness.The scale effects are analyzed adopt surface layer effect.The plasticity and flow stress increase with grain size growth,because the volume ratio of grains on surface layer increases.Flow stress reduces with thickness reducing,which is also because the effect of surface layer.

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Reference：

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