锻压技术

Cu-9Ni-6Sn合金显微硬度及微观组织研究

英文标题：Study on microhardness and microstructure for Cu-9Ni-6Sn alloy

作者：武峥1 2 龚留奎1 2 3 赵孝孝1 2 刘晓彬1 2 宋士鑫1 2 邓立勋1 2 黄伟1 2

单位：（1.中国兵器科学研究院宁波分院浙江宁波 315103 2.内蒙金属材料研究所内蒙古包头 014034 3.北方材料科学与工程研究院有限公司浙江宁波 315103）

分类号：TG146.1

出版年,卷(期):页码：2025,50(4):97-106

摘要：

采用OM、SEM、EBSD、TEM及硬度计等检测手段，研究了Cu-9Ni-6Sn合金的微观组织与性能，结果表明：挤压处理后，Cu-9Ni-6Sn合金的晶粒尺寸大幅度降低，基本呈等轴晶且分布较为均匀，铸态晶界处粗大的富Sn相发生破碎并且数量有所减少，内部主要存在微米级的富Sn相和纳米级的长条状、颗粒状NixSny化合物。Cu-9Ni-6Sn合金较优的固溶工艺为950 ℃/2 h+水淬，该过程中伴随着晶界迁移和晶粒合并，晶粒长大至394.565 μm，但晶界处微米级富Sn相和纳米级NixSny化合物基本全部回溶至基体中，只有少量颗粒状富Sn残留，整体固溶效果良好。

The microstructure and properties of Cu-9Ni-6Sn alloy were studied by using the detection methods such as OM， SEM， EBSD， TEM and hardness tester. The results show that after extrusion treatment， the grain size of Cu-9Ni-6Sn alloy is greatly reduced， and it is basically equiaxed and evenly distributed. The coarse Sn-rich phase at the as-cast grain boundary is broken and the number is reduced. The interior mainly contains micro-sized Sn-rich phase, nano-sized long strip and granular NixSny compounds. The optimal solid solution process of Cu-9Ni-6Sn alloy is 950 ℃/2 h+water quenching. During this process， the grains grow to 394.565 μm， accompanying grain boundary migration and grain merging. However， the micro-sized Sn-rich phase and nano-sized NixSny compounds at the grain boundary are basically dissolved back into the matrix， and only a small amount of granular Sn-rich phase remains. The overall solid solution effect is good.

基金项目：

基金项目:创建国家自主创新示范区项目(XM2024XTGXQ12)；宁波市重点研发计划(2023Z092,2023Z096)

作者简介：武峥(1998-)，男，硕士研究生

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