锻压技术

不同厚度配比铜/铝复合板结合强度分析

英文标题：Bonding strength analysis on copper/aluminum composite plates with different thickness ratios

作者：张玉静徐镇

单位：山东职业学院

分类号：TG335.5

出版年,卷(期):页码：2019,44(8):162-167

摘要：

通过实验研究和数值模拟手段研究了不同厚度配比对铜/铝复合板结合强度的影响。实验结果表明：随着铜铝厚度配比的增大，复合板的结合强度不断提高，铜基剥离面的粘铝量也逐渐增加；铜/铝厚度配比为1/6和1/5时，铜基表面黏着少量细小的铝脊和局部点片状铝屑；当铜铝厚度配比达到1/3时，铜基剥离面铝脊数量明显增加，且铝脊的体积变大。结合模拟结果分析发现，随着铜铝厚度配比的增大，复合板结合界面处正应力和等效应变逐渐增大，促进金属间的结合；铜铝厚度配比较小时，界面处强烈的摩擦剪切应力促使铝基表面的硬化层脱落，形成铝屑黏着于铜侧。

The influences of different thickness ratios of copper to aluminium on the bonding strength of copper/aluminium composite plates were studied by means of experimental research and numerical simulation. The experimental results show that the bonding strength of composite plate increases with the increasing of the thickness ratio of copper to aluminium, and the amount of aluminium adhering to the copper-based peeling surface also increases gradually. When the thickness ratio of copper to aluminium is 1/6 and 1/5, a small amount of fine aluminium ridges and local spot-sheet aluminium chips adhere to the surface of copper base. However, when the copper/aluminum thickness ratio reaches 1/3, the amount of aluminum ridges on the copper-based peeling surface is significantly increased, and the volume of the aluminum ridges becomes larger. Combined with the simulation results, it is found that with the increasing of the thickness ratio of copper to aluminum, the normal stress and equivalent strain at the interface of composite plate gradually increase, which promote the bonding between metals. Therefore, when the thickness ratio of copper to aluminum is relatively small, the strong frictional shear stress at the interface causes the hardened layer on the surface of aluminum based to fall off, and the formed aluminum chips adhere to the copper side.

基金项目：

山东省教育厅职业教育名师工作室支持项目（201763）

作者简介：张玉静（1982-），女，硕士，讲师 E-mail：710805266@qq.com

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