锻压技术

Ag-Cu钎料粉末压制致密化行为

英文标题：Densification behavior of powder pressing for Ag-Cu solder

作者：刘运展胡建华黄尚宇胡飞丁鹏飞李鑫

单位：武汉理工大学

分类号：TF124

出版年,卷(期):页码：2018,43(4):76-82

摘要：

采用离散元软件EDEM，基于Hysteretic Spring接触模型，对BAg72Cu28和BAg47Cu53钎料压制成形过程进行模拟，并对BAg47Cu53钎料进行低速压制实验。分析了钎料压制的成形机理、速度场特性及压制速度、摩擦系数对压坯致密度的影响。结果表明：压制初期上部粉末速度最大，压制中后期中部粉末速度最大，压坯致密度分布特性与中后期速度场特性一致；压制相同致密度的压坯，高速压制比低速压制的致密度均匀性更高；颗粒间摩擦系数越低，压坯致密度均匀性越高，相同压制力下摩擦系数越低，压坯致密度越高；除松装状态下，BAg47Cu53钎料低速压制的压坯致密度的模拟值与实验值误差小于6%，Hysteretic Spring接触模型进行钎料压制模拟具有较高的模拟精度。

Based on Hysteretic Spring contact model, the pressing process of BAg72Cu28 and BAg47Cu53 solder was simulated by discrete element software EDEM, and the pressing experiments at low speed of BAg47Cu53 solder were carried out. Then, the influences of forming mechanism, characteristics of velocity field, pressing speed and friction coefficient of solder pressing on the density of compaction were analyzed. The results show that the velocity of top powder is the biggest in the early stage of pressing, while the velocity of middle powder is the biggest in the middle and late stages of pressing. The density distribution characteristics of compaction are in agreement with the velocity field characteristics in the middle and late stages. The density uniformity of compaction in high speed pressing is better than that in low speed pressing when pressing the same density of compaction. But the lower the friction coefficient between particles is, the higher the density uniformity of compaction is. And, the lower the friction coefficient under the same pressing force is, the higher the density of compaction is. In addition to the loose state, the density difference of compaction between simulation and experiment in low speed pressing of BAg47Cu53 solder is less than 6%, and the Hysteretic Spring contact model has higher simulation accuracy for solder pressing simulation.

基金项目：

国家自然科学基金资助项目（51475345）；华中科技大学材料成形与模具技术国家重点实验室开放基金（P2015-01）

刘运展（1993-），男，硕士研究生；E-mail：453178919@qq.com；通讯作者：胡建华（1966-），男，博士，副教授；E-mail： hujianhua@whut.edu.cn

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