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基于Dynaform的整体式波形片成形回弹研究及其模具参数优化
英文标题:Study on springback and optimization on die structure parameters for
作者:刘飞 范昇 廖宏谊 余汉红 鲍家定 屈婧婧 李海林 
单位:桂林电子科技大学 桂林福达股份有限公司 桂林航天工业学院 
关键词:65Mn 整体式波形片 成形回弹 Dynaform 模具参数优化 
分类号:U464.9
出版年,卷(期):页码:2018,43(9):29-36
摘要:
以某型号65Mn离合器整体式波形片为研究对象,结合逆向试算法确定参数模型,通过Dynaform有限元分析软件对该波形片子片(厚度t为0.6 mm)的成形及回弹过程进行了数值模拟,分析了不同虚拟冲压速度对材料应力应变及回弹量的影响。当速度参数设定在200 mm·s-1时,研究了模具深度及弯曲半径对波形片成形高度的影响规律,从而按照模拟结果优化了模具结构参数。其中,弯曲半径越大,回弹量越大;而模具深度越小,则回弹量越大,成形高度数值越小。试验结果表明,当模具关键参数R1(R2),R3,R4,H1,H2和H3分别为13.5,21,24,1.8,1.2和1.3 mm时,可加工出符合产品要求的波形片,回弹过程模拟与实际生产结果取得较好的吻合性,这也说明了Dynaform可以较好地模拟计算厚度较小且材料屈服强度偏高的接触卸载回弹问题。
For the integral waveform piece 65Mn of the clutch, combining the reverse trial method to determine parameter model, the forming and springback of waveform piece (t=0.6 mm) were simulated by the FEM software Dynaform, and the influences of different virtual forming velocities on stress, strain and spingback of material were analyzed. Then, when the velocity was 200 mm·s-1, the influences of die depth and bending radius on forming height of waveform piece were studied, and the die structure parameters were optimized according to simulation results. Wherein, the spingback increased with the increase of bending radius, and the springback increased and forming height decreased with the decrease of die depth. The experimental results show that when the key parameters of die R1(R2), R3, R4, H1, H2 and H3 are 13.5, 21, 24, 1.8, 1.2 and 1.3 mm respectively, the qualified waveform piece can be produced to meet the requirements of the product, and the simulation results are in good accordance with the results of the product manufactured in factory. Thus, the contact unloading springback process for smaller thickness and higher yield strength can be preferably simulated by software Dynaform.
基金项目:
国家自然科学基金资助项目(51605108)
作者简介:
作者简介:刘飞(1985-),男,博士,讲师 E-mail:liufeiguet@163.com 通讯作者:范昇(1988-),男,学士,工程师 E-mail:410920755@qq.com
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